HVBD75


Notes

  • No data indicates the component is a standard recovery device and no TRR data is taken.
  • "C" Dimension is end hole center to center. There is also a middle hole on this board, offset 3" and 3.17".

Specification

DESCRIPTION specification conditions VALUE
Maximum Repetitive Reverse VoltageVRRMPer Leg75000 V
Maximum Forward Voltage DropVFAt IFAVM, Per Leg110 V
Maximum Average Forward CurrentIFAVMAt 55°C220 mA
Maximum Leakage CurrentIRAt VRRM, 25°C2.00 μA
Maximum Surge CurrentIFSMAt 8.3mS20 A
Operating Temperature RangeOP TEMP-55 to 125 °C
Storage Temperature RangeSTG TEMP-55 to 150 °C
Board LengthLDimension6.5 in
Hole DiameterDDimension0.14 in
Mounting Holes, Center to CenterCDimension6.17 in