SLA05MG


Notes

  • Long Surface Mount Package
  •  J Lead or Gullwing Package Option
  • Available in Cut Tape and 1000 Piece Reels
  • Molded Plastic Body, ANSI/UL94 V-0 Rated Material
  • Specifications based on diode PCB mounted on 0.2” x 0.2” (5.0mm x 5.0mm) copper solder pads

Specification

DESCRIPTION specification conditions VALUE
Maximum Repetitive Reverse Voltage VRRMAt 25°C 5000 V
Maximum Average Forward Current IFAVMAt 55°C Lead Temperature 650 mA
Maximum Average Forward Current IFAVMAt 100°C Lead Temperature 330 mA
Maximum Average Forward Current IFAVMAt 70°C Case Temperature 300 mA
Maximum Forward Voltage Drop VFAt IFAVM, 25°C 12 V
Maximum Leakage Current IRAt VRRM, 25°C 2 μA
Maximum Surge Current IFSMAt 8.3mS, Single Half Sine 15 A
Typical Junction Capacitance CJ6.5 pF
Maximum Reverse Recovery Time TRRAt IF = 0.5 IFAVM; IR = -IFAVM; IRR = -0.25 IFAVM; 25°C100 nS
Typical Thermal Resistance (Junction to Lead) RθJL16 °C/W
Typical Thermal Resistance (Junction to Case) RθJC30 °C/W
Storage Temperature RangeSTG TEMP-55 to 175 °C
Operating Temperature Range OP TEMP-55 to 150 °C
Maximum Junction Temperature TJMAX150 °C