SLA10SG
Notes
- Specifications based on diode PCB mounted on 0.2” x 0.2” (5.0mm x 5.0mm) copper solder pads.
Specification
| DESCRIPTION | specification | conditions | VALUE |
|---|---|---|---|
| Maximum Repetitive Reverse Voltage | VRRM | At 25°C | 10000 V |
| Maximum Forward Voltage Drop | VF | At IFAVM, 25°C | 25.2 V |
| Maximum Average Forward Current | IFAVM | At 55°C Lead Temperature | 95 mA |
| Maximum Average Forward Current | IFAVM | At 100°C Lead Temperature | 30 mA |
| Maximum Average Forward Current | IFAVM | At 70°C Case Temperature | 55 mA |
| Maximum Leakage Current | IR | At VRRM, 25°C | 0.5 μA |
| Maximum Surge Current | IFSM | At 8.3mS, Single Half Sine | 3 A |
| Typical Junction Capacitance | CJ | 1.1 pF | |
| Maximum Junction Temperature | TJMAX | 125 °C | |
| Maximum Reverse Recovery Time | TRR | At IF = 0.5 IFAVM; IR = -IFAVM; IRR = -0.25 IFAVM; 25°C | 100 nS |
| Typical Thermal Resistance (Junction to Lead) | RθJL | 50 °C/W | |
| Typical Thermal Resistance (Junction to Case) | RθJC | 57 °C/W | |
| Operating Temperature Range | OP TEMP | -55 to 125 °C | |
| Storage Temperature Range | STG TEMP | -55 to 175 °C |