SLA20LG


Notes

  • Specifications based on diode PCB mounted on 0.2” x 0.2” (5.0mm x 5.0mm) copper solder pads.

Specification

DESCRIPTION specification conditions VALUE
Maximum Repetitive Reverse Voltage VRRMAt 25°C 20000 V
Maximum Forward Voltage Drop VFAt IFAVM, 25°C 39.7 V
Maximum Average Forward Current IFAVMAt 55°C Lead Temperature 400 mA
Maximum Average Forward Current IFAVMAt 100°C Lead Temperature 125 mA
Maximum Average Forward Current IFAVMAt 70°C Case Temperature 125 mA
Maximum Leakage Current IRAt VRRM, 25°C 0.5 μA
Maximum Surge Current IFSMAt 8.3mS, Single Half Sine 15 A
Typical Junction Capacitance CJ3.8 pF
Maximum Junction Temperature TJMAX125 °C
Maximum Reverse Recovery Time TRRAt IF = 0.5 IFAVM; IR = -IFAVM; IRR = -0.25 IFAVM; 25°C100 nS
Typical Thermal Resistance (Junction to Lead) RθJL13 °C/W
Typical Thermal Resistance (Junction to Case) RθJC26 °C/W
Operating Temperature Range OP TEMP-55 to 125 °C
Storage Temperature RangeSTG TEMP-55 to 175 °C