• Specifications based on diode PCB mounted on 0.2” x 0.2” (5.0mm x 5.0mm) copper solder pads.


DESCRIPTION specification conditions VALUE
Maximum Repetitive Reverse VoltageVRRMAt 25°C8000 V
Maximum Forward Voltage DropVFAt 100mA, 25°C12 V
Maximum Average Forward CurrentIFAVMAt 55°C Lead Temperature850 mA
Maximum Average Forward CurrentIFAVMAt 100°C Lead Temperature450 mA
Maximum Average Forward CurrentIFAVMAt 80°C Case Temperature400 mA
Maximum Leakage CurrentIRAt VRRM, 25°C0.5 μA
Maximum Surge CurrentIFSMAt 8.3mS, Single Half Sine20 A
Typical Junction CapacitanceCJ7.5 pF
Maximum Junction TemperatureTJMAX150 °C
Maximum Reverse Recovery TimeTRRAt IF = 250mA; IR = -500mA; IRR = -12 mA; 25°C40 nS
Typical Thermal Resistance (Junction to Lead)RθJL13 °C/W
Typical Thermal Resistance (Junction to Case)RθJC20 °C/W
Operating Temperature RangeOP TEMP-55 to 150 °C
Storage Temperature RangeSTG TEMP-55 to 175 °C