SLU08MG

Specifications based on diode PCB mounted on 0.2” x 0.2” (5.0mm x 5.0mm) copper solder pads.

DESCRIPTION	specification	conditions	VALUE
Maximum Repetitive Reverse Voltage	VRRM	At 25°C	8000 V
Maximum Forward Voltage Drop	VF	At 100mA, 25°C	12 V
Maximum Average Forward Current	IFAVM	At 55°C Lead Temperature	850 mA
Maximum Average Forward Current	IFAVM	At 100°C Lead Temperature	450 mA
Maximum Average Forward Current	IFAVM	At 80°C Case Temperature	400 mA
Maximum Leakage Current	IR	At VRRM, 25°C	0.5 μA
Maximum Surge Current	IFSM	At 8.3mS, Single Half Sine	20 A
Typical Junction Capacitance	CJ		7.5 pF
Maximum Junction Temperature	TJMAX		150 °C
Maximum Reverse Recovery Time	TRR	At IF = 250mA; IR = -500mA; IRR = -12 mA; 25°C	40 nS
Typical Thermal Resistance (Junction to Lead)	RθJL		13 °C/W
Typical Thermal Resistance (Junction to Case)	RθJC		20 °C/W
Operating Temperature Range	OP TEMP		-55 to 150 °C
Storage Temperature Range	STG TEMP		-55 to 175 °C