6HG20
Notes
- Epoxy Molded Encapsulation
- Threaded Brass Solder Terminal Inserts
- No data indicates the component is a standard recovery device and no TRR data is taken.
Specification
| DESCRIPTION | specification | conditions | VALUE |
|---|---|---|---|
| Maximum Repetitive Reverse Voltage | VRRM | 20000 V | |
| Maximum Forward Voltage Drop | VF | At IFAVM, 25°C | 20 V |
| Maximum Average Forward Current | IFAVM | At 55°C | 2.5 mA |
| Maximum Leakage Current | IR | At VRRM, 25°C | 5.00 μA |
| Maximum Surge Current | IFSM | At 8.3mS | 400 A |
| Maximum Junction Temperature | TJMAX | 150 °C | |
| Operating Temperature Range | OP TEMP | -55 to 150 °C | |
| Storage Temperature Range | STG TEMP | -55 to 150 °C |