SLP10M


Notes

  • Specifications based on diode PCB mounted on 0.2” x 0.2” (5.0mm x 5.0mm) copper solder pads.

Specification

DESCRIPTION specification conditions VALUE
Maximum Repetitive Reverse VoltageVRRMAt 25°C10000 V
Maximum Forward Voltage DropVFAt 200mA, 25°C15.8 V
Maximum Average Forward CurrentIFAVMAt 55°C Lead Temperature450 mA
Maximum Average Forward CurrentIFAVMAt 100°C Lead Temperature230 mA
Maximum Average Forward CurrentIFAVMAt 80°C Case Temperature300 mA
Maximum Leakage CurrentIRAt VRRM, 25°C0.5 μA
Maximum Surge CurrentIFSMAt 8.3mS, Single Half Sine15 A
Typical Junction CapacitanceCJ3.7 pF
Maximum Junction TemperatureTJMAX150 °C
Maximum Reverse Recovery TimeTRRAt IF = 100mA; IR = -200mA; Irr = -50mA; 25°C75 nS
Typical Thermal Resistance (Junction to Lead)RθJL17 °C/W
Typical Thermal Resistance (Junction to Case)RθJC27 °C/W
Operating Temperature RangeOP TEMP-55 to 150 °C
Storage Temperature RangeSTG TEMP-55 to 175 °C